Advances in electronic packaging, 1999：proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference : InterPACK '99 : presented at the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, June 13-19, 1999, Maui, Hawaii

Corporate Authors: Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference (1999 Maui, Hawaii); American Society of Mechanical Engineers. Electrical and Electronic Packaging Division.
Group Author: Saka M.; (Masumi); Lee Yung-Cheng.; Agonafer D.
Published: American Society of Mechanical Engineers,
Publication Dates: c1999.
Call Number: TN05-1/P117/1999/v.1