电子软钎焊连接技术：材料、性能及可靠性 = Solder joint technology：materials, properties, and reliability

Main Authors: (美) 杜经宁 ((美)杜经宁(King-Ning Tu)著)
Group Author: 赵修臣 (译); 霍永隽 (译); 宁先进 (译)
Published: 北京理工大学出版社有限责任公司
Publication Dates: 2021
Call Number: TG454/4923