1
硅整流元件焊接密封工艺报告

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Main Authors: 钟士谦 (钟士谦，陈利才编); 陈利才
Published: [出版者不详]
Publication Dates: [196?]
Call Number: 440.6/8140
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2
离子注入技术

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Main Authors: 张光华 (编著)
Group Author: 钟士谦 (编著)
Published: 机械工业出版社
Publication Dates: 1982
Call Number: TN305.3/1292
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3
功率半导体器件 工作原理和制造工艺

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Main Authors: 格安迪 S,K. (著); Ghandhi HS.K. (著)
Group Author: 张光华 (译); 钟士谦 (译)
Published: 机械工业出版社
Publication Dates: 1982
Call Number: TN303/4933
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