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1

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Digest of papers, Boston, Mass. May 31 - June 1, 1983

Corporate Authors: Boston); IEEE 1983 Microwave and millimeter-Wave Monolithic Circuits Symposium (1983
Group Author: Spielman B. E
Published: IEEE,
Publication Dates: 1983.
Call Number: TN454-53/I59/1983/

Book

2

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2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, (EPEPS 2010), Austin, Texas, USA, 25-27 October 2010

Corporate Authors: Topical Meeting on Electrical Performance of Electronic Packaging (19th 2010 Austin, Texas; IEEE Microwave Theory and Techniques Society; Components, Packaging & Manufacturing Technology Society
Published: IEEE,
Publication Dates: c2010.
Call Number: TN05-532/I227/2010

Book

3

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2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems：October 23-26, 2011, Double Tree Hotel, San Jose, California

Corporate Authors: IEEE Conference on Electrical Performance of Electronic Packaging and Systems (20th 2011 San Jose, Calif; IEEE Microwave Theory and Techniques Society; Components, Packaging & Manufacturing Technology Society
Published: IEEE,
Publication Dates: [2011]
Call Number: TN05-532/I221-1/2011

Book

4

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2008 IEEE-EPEP Electrical Performance of Electronic Packaging：27-29 October, 2008, San Jose, California

Corporate Authors: IEEE Topical Meeting on Electrical Performance of Electronic Packaging (2008 San Jose, Californie; IEEE Microwave Theory and Techniques Society; IEEE Components, Packaging and Manufacturing Technology Society
Published: IEEE
Publication Dates: c2008.
Call Number: TN05-532/E38/2008

Book

5

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2007 IEEE Electrical performance of electronic packaging：October 29-31, 2007, Renaissance Atlanta Downtown Hotel, Atlanta, Georgia

Corporate Authors: Topical Meeting on Electrical Performance of Electronic Packaging (16th 2007 Atlanta, Ga; IEEE Microwave Theory and Techniques Society; Components, Packaging & Manufacturing Technology Society; IEEE Xplore Online service
Published: IEEE,
Publication Dates: [c2007]
Call Number: TN05-532/E38/2007

Book

6

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Electrical Performance of Electronic Packaging：October 23-25, 2006 : Scottsdale, Arizona

Corporate Authors: Topical Meeting on Electrical Performance of Electronic Packaging (15th 2006 Scottsdale, Ariz; IEEE Microwave Theory and Techniques Society; Components, Packaging & Manufacturing Technology Society
Published: IEEE,
Publication Dates: c2006.
Call Number: TN05-532/E38/2006

Book

7

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Electrical performance of electronic packaging：October 25-27, 2004, Portland Hilton and Executive Tower, Portland, Oregon

Corporate Authors: Topical Meeting on Electrical Performance of Electronic Packaging (13th 2004 Portland, Ore; IEEE Microwave Theory and Techniques Society; Components, Packaging & Manufacturing Technology Society
Published: IEEE,
Publication Dates: c2004.
Call Number: TN05-532/E38/2004

Book

8

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Electrical performance of electronic packaging：October 24-26, 2005, Radisson Hotel & Suites Town Lake, Austin, Texas

Corporate Authors: Topical Meeting on Electrical Performance of Electronic Packaging (14th 2005 Austin, Texas; IEEE Microwave Theory and Techniques Society; Components, Packaging & Manufacturing Technology Society
Published: IEEE,
Publication Dates: c2004.
Call Number: TN05-532/E38/2005

Book

9

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Electrical performance of electronic packaging：October 27-29, 2003, the Westin Princeton, Princeton, New Jersey

Corporate Authors: Components, Packaging & Manufacturing Technology Society; Topical Meeting on Electrical Performance of Electronic Packaging 2003 Princeton, N.J.); IEEE Microwave Theory and Techniques Society
Published: IEEE,
Publication Dates: [2003]
Call Number: TN05-532/E38/2003

Book

10

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Electrical performance of electronic packaging：October 21-23, 2002, Hyatt Regency Monterey, Monterey, California

Corporate Authors: Topical Meeting on Electrical Performance of Electronic Packaging (11th 2002 Monterey, Calif; IEEE Microwave Theory and Techniques Society; Components, Packaging & Manufacturing Technology Society
Published: IEEE,
Publication Dates: [c2002].
Call Number: TN05-532/E38/2002

Book

11

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Electrical performance of electronic packaging：October 22-31, 2001, Royal Sonesta Hotel, Cambridge, Massachusetts

Corporate Authors: Topical Meeting on Electrical Performance of Electronic Packaging (10th 2001 Cambridge, Mass; IEEE Microwave Theory and Techniques Society; Components, Packaging & Manufacturing Technology Society
Published: IEEE,
Publication Dates: c2001.
Call Number: TN05-532/E38/2001

Book

12

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2001 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium：digest of papers : [Phoenix Civic Plaza, May 20-22, 2001]

Corporate Authors: IEEE Radio Frequency Integrated Circuits Symposium (2001 Phoenix, Arizona; IEEE Microwave Theory and Techniques Society; IEEE Electron Devices Society
Group Author: Boglione Luciano
Published: IEEE,
Publication Dates: c2001.
Call Number: TN454-532/I59/2001

Book

13

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Electrical performance of electronic packaging：October 23-25, 2000, Radisson Resort & Spa Scottsdale, Scottsdale, Arizona

Corporate Authors: Components, Packaging & Manufacturing Technology Society; Topical Meeting on Electrical Performance of Electronic Packaging 2000 Scottsdale, Arizona); IEEE Microwave Theory and Techniques Society
Published: IEEE],
Publication Dates: c2000.
Call Number: TN05-532/E38/2000

Book

14

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2000 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium：digest of papers

Corporate Authors: IEEE Radio Frequency Integrated Circuits Symposium (2000 Boston, Mass; IEEE Microwave Theory and Techniques Society; IEEE Electron Devices Society
Group Author: Camilleri Natalino
Published: IEEE,
Publication Dates: c2000.
Call Number: TN454-532/I59/2000

Book

15

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Electrical performance of electronic packaging：October 25-27, 1999, The Catamaran Hotel, San Diego, California

Corporate Authors: Components, Packaging & Manufacturing Technology Society; Topical Meeting on Electrical Performance of Electronic Packaging 1999 San Diego, California); IEEE Microwave Theory and Techniques Society
Published: IEEE Service Center,
Publication Dates: c1999.
Call Number: TN05-532/E38/1999/

Book

16

Cover is for reference only

1999 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium：digest of papers

Corporate Authors: IEEE Radio Frequency Integrated Circuits Symposium (1999 Anaheim, California; IEEE Microwave Theory and Techniques Society; IEEE Electron Devices Society
Group Author: Moniz Jim
Published: IEEE,
Publication Dates: c1999.
Call Number: TN454-532/I59/1999/

Book

17

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Electrical performance of electronic packaging：October 26-28, 1998, The Hotel Thayer, West Point, New York

Corporate Authors: Components, Packaging & Manufacturing Technology Society; Topical Meeting on Electrical Performance of Electronic Packaging 1998 West Point, New York); IEEE Microwave Theory and Techniques Society
Published: IEEE Service Center,
Publication Dates: c1998.
Call Number: TN05-532/E38/1998/

Book

18

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International Topical Meeting on Microwave Photonics : MWP'98 : technical digest : (including High Speed Photonics Components Workshop) : October 12-14, 1998, Sarnoff Corporation, Princeton, New Jersey

Corporate Authors: International Topical Meeting on Microwave Photonics (1998 Princeton, New Jersey; Lasers and Electro-optics Society Institute of Electrical and Electronics Engineers; IEEE Microwave Theory and Techniques Society; High Speed Photonics Components Workshop (1998 Princeton, New Jersey)
Published: IEEE,
Publication Dates: c1998.
Call Number: TN925-532/I61/1998/

Book

19

Cover is for reference only

1998 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium：digest of papers

Corporate Authors: IEEE Radio Frequency Integrated Circuits Symposium (1998 Baltimore, Md; IEEE Microwave Theory and Techniques Society; IEEE Electron Devices Society
Group Author: Mondal Jyothi
Published: IEEE,
Publication Dates: c1998.
Call Number: TN454-532/I59/1998/

Book

20

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Electrical performance of electronic packaging：October 27-29, 1997, San Jose, California

Corporate Authors: Components, Packaging & Manufacturing Technology Society; IEEE Topical Meeting on Electrical Performance of Electronic Packaging 1997 San Jose, California); IEEE Microwave Theory and Techniques Society
Published: IEEE,
Publication Dates: [1997?]
Call Number: TN05-532/E38/1997/

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