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Modeling and simulation for microelectronic packaging assembly manufacture, reliability, and testing /

"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation."--

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Bibliographic Details
Main Authors: Liu, S. Sheng, 1963
Corporate Authors: Wiley InterScience Online service
Group Author: Liu, Yong, 1962
Published:
Literature type: Electronic eBook
Language: English
Subjects:
Microelectronic packaging > Simulation methods
TECHNOLOGY & ENGINEERING / Electronics / Circuits / General
Electronic books
Online Access: http://onlinelibrary.wiley.com/book/10.1002/9780470827826
Summary: "This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation."--
Carrier Form: 1 online resource (xxi, 564 p.) : ill. (some col.)
Bibliography: Includes bibliographical references and index.
ISBN: 9780470827826 (electronic bk.)
0470827823 (electronic bk.)
Index Number: TK7870
CLC: TN05-532
Contents: Front Matter -- Mechanics and Modeling. Constitutive Models and Finite Element Method -- Material and Structural Testing for Small Samples -- Constitutive and User-Supplied Subroutines for Solders Considering Damage Evolution -- Accelerated Fatigue Life Assessment Approaches for Solders in Packages -- Multi-Physics and Multi-Scale Modeling -- Modeling Validation Tools -- Application of Fracture Mechanics -- Concurrent Engineering for Microelectronics -- Modeling in Microelectronic Packaging and Assembly. Typical IC Packaging and Assembly Processes -- Opto Packaging and Assembly -- MEMS and M

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