Modeling and simulation for microelectronic packaging assembly manufacture, reliability, and testing /
"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation."--
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Literature type: | Electronic eBook |
Language: | English |
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Online Access: |
http://onlinelibrary.wiley.com/book/10.1002/9780470827826 |
Summary: |
"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation."-- |
Carrier Form: | 1 online resource (xxi, 564 p.) : ill. (some col.) |
Bibliography: | Includes bibliographical references and index. |
ISBN: |
9780470827826 (electronic bk.) 0470827823 (electronic bk.) |
Index Number: | TK7870 |
CLC: | TN05-532 |
Contents: | Front Matter -- Mechanics and Modeling. Constitutive Models and Finite Element Method -- Material and Structural Testing for Small Samples -- Constitutive and User-Supplied Subroutines for Solders Considering Damage Evolution -- Accelerated Fatigue Life Assessment Approaches for Solders in Packages -- Multi-Physics and Multi-Scale Modeling -- Modeling Validation Tools -- Application of Fracture Mechanics -- Concurrent Engineering for Microelectronics -- Modeling in Microelectronic Packaging and Assembly. Typical IC Packaging and Assembly Processes -- Opto Packaging and Assembly -- MEMS and M |