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Author: co-sponsored by the IEEE Components, Hybrids and Manufacturing Technology Society of the IEEE, and the Electronic Industries Association

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IEEE Transactions on Components, Packaging, and Manufacturing Technology

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Bibliographic Details
Corporate Authors: Institute of Electrical and Electronics Engineers IEEE Components, Packaging, and Manufacturing Technology Society
Published: The Society
Publisher Address: New York, NY
Publication Dates: 2011-
Literature type: Journal
Language: English
Online Access: http://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=5503870
Carrier Form: v.: ill. ; 28cm
Publication Frequency: Monthly
ISSN: 2156-3950
2156-3985 online
Order Number: 730B0001TCP
Index Number: TN1
CLC: TN1
Call Number: P19152
Journal Holding: Vol.1-6 2011-16
Contents: Merger of: IEEE Transactions on Advanced Packaging (ISSN 1521-3323); and of: IEEE Transactions on Components and Packaging Technology (ISSN 1521-3331); and of: IEEE Transations on Electronics Packaging Manufacturing (ISSN 1521-334X)
Some issues combined

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