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Materials for information technology：devices, interconnects and packaging

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Bibliographic Details
Corporate Authors: Euromat 2003 (2003 Lausanne, Switzerland; Euromat 2003 (2003 Lausanne, Switzerland)
Group Author: Zschech Ehrenfried; Whelan Caroline; Mikolajick Thomas
Published: Springer,
Publisher Address: London
Publication Dates: c2005.
Literature type: Book
Language: English
Series: Engineering materials and processes
Subjects:
Microelectronics > Materials
Information technology
Carrier Form: xix, 508 p.: ill. ; 24 cm.
ISBN: 1852339411 (hbk.)
Index Number: TN4
CLC: TN4-532
Call Number: TN4-532/M425/2003
Contents: Selected conference papers.
Includes bibliographical references and index.

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