Screen LibraryModeling, analysis, design and tests for electronics packaging beyond Moore / 超摩尔时代电子封装建模, 分析, 设计与测试 / 张恒运, 车法星, 林挺宇, 赵文生著.
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| Main Authors: | |
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| Group Author: | ; ; |
| Published: |
化学工业出版社,
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| Publisher Address: | 北京市 : |
| Publication Dates: | 2021. |
| Literature type: | Book |
| Language: | English |
| Edition: | 第1版. |
| Series: |
Series on advanced electronic packaging technology and key materials = 先进电子封装技术与关键材料丛书
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| Subjects: | |
| Item Description: | " '十三五' 国家重点图书." |
| Carrier Form: | xv, 420 pages : illustrations ; 25 cm. |
| Bibliography: | Includes bibliographical references and index. |
| ISBN: |
9787122379528 7122379523 |
| Index Number: | TJ7870 |
| CLC: | TN05 |
| Call Number: | TN05/Z633/chi |