Screen Library2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration : (LTB-3D 2014) : Tokyo, Japan, 15-16 July 2014.
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| Literature type: | Book |
| Language: | English |
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| Item Description: | "IEEE catalog number: CFP1418S-POD" |
| Carrier Form: | 63 p. : ill. ; 28 cm. |
| Bibliography: | Includes bibliographical references. |
| ISBN: | 9781479952625 : |
| Index Number: | TJ246 |
| CLC: | TN405-532 |
| Call Number: | TN405-532/I594/2014 |