Stress-induced phenomena in metallization:Tenth International Workshop on Stress-Induced Phenomena in Metallization, Austin, Texas, 5-7 November 2008

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Bibliographic Details
Corporate Authors: International Workshop on Stress-Induced Phenomena in Metallization (10th 2008 Austin, Texas)
Group Author: Ogawa Shinʾichi.; Zschech Ehrenfried.; Ho P. S.
Published: American Institute of Physics,
Publisher Address: Melville, N.Y.
Publication Dates: ; 2009.
Literature type: Book
Language: English
Series: AIP conference proceedings ; v. 1143
Subjects:
Carrier Form: vii, 233 p.: ill. ; 24 cm.
ISBN: 9780735406803
0735406804
Index Number: TG172
CLC: TG172.9-532
Call Number: TG172.9-532/S915/2008
Contents: Includes bibliographical references and index.
Electromigration in copper interconnects -- Low-K dielectrics and barrier layers -- Microstructure and stress behavior of Cu structures -- Chip package interaction, nanostructures and 3D interconnects.