Stress-induced phenomena in metallization:Tenth International Workshop on Stress-Induced Phenomena in Metallization, Austin, Texas, 5-7 November 2008
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Corporate Authors: | |
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Group Author: | ; ; |
Published: |
American Institute of Physics,
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Publisher Address: | Melville, N.Y. |
Publication Dates: | ; 2009. |
Literature type: | Book |
Language: | English |
Series: |
AIP conference proceedings ; v. 1143 |
Subjects: | |
Carrier Form: | vii, 233 p.: ill. ; 24 cm. |
ISBN: |
9780735406803 0735406804 |
Index Number: | TG172 |
CLC: | TG172.9-532 |
Call Number: | TG172.9-532/S915/2008 |
Contents: |
Includes bibliographical references and index. Electromigration in copper interconnects -- Low-K dielectrics and barrier layers -- Microstructure and stress behavior of Cu structures -- Chip package interaction, nanostructures and 3D interconnects. |