先进微电子3D-IC构装 = Advanced microelectronic 3D-IC packaging
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Main Authors: | |
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Published: |
五南图书出版股份有限公司
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Publisher Address: | 台北 |
Publication Dates: | 2017 |
Literature type: | Book |
Language: | Chinese |
Edition: | 3版 |
Subjects: | |
Carrier Form: | 340页: 图 ; 23cm |
ISBN: | 978-957-11-9011-2 |
Index Number: | TN405 |
CLC: | TN405.94 |
Call Number: | TN405.94/3765 |
Contents: | 有书目和索引 |