IEEE Transactions on Components and Packaging Technologies

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Bibliographic Details
Corporate Authors: Institute of Electrical and Electronics Engineers IEEE Components, Packaging and Manufacturing Technology Society
Published: IEEE Inc.
Publisher Address: New York
Publication Dates: 1999-2010
Literature type: Journal
Language: English
Online Access: http://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=6144
Carrier Form: 12 v.: ill. ; 29cm
Publication Frequency: Quarterly
ISSN: 1521-3331
1557-9972 online
Order Number: 730B0001TCP1
Index Number: TN1
CLC: TN1
Call Number: P11668-1A/12483-1A
Journal Holding: Vol.22-33 1999-2010
Contents: Continues: IEEE Transactions on Components Packaging & Manufacturing Technology. Pt.A
Merged with: IEEE Transactions of Advanced Packaging (ISSN 1521-3323); and: IEEE Transations on Electronics Packaging Manufacturing (ISSN 1521-334X) to become: IEEE Transactions on Components, Packaging, and Manufacturing Technology (ISSN 2156-3950)