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Proceedings of the Symposium on Polymeric Materials for Electronic Packaging and High Technology Applications

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Bibliographic Details
Corporate Authors: Symposium on Polymeric Materials for Electronic Packaging and High Technology Applications (1987 Honolulu, Hawaii)
Group Author: Susko J.R.; (John R.); Snyder R.W.; (Randy W.); Susko R.A.; (Robin A.)
Published: Electrochemical Society,
Publisher Address: Pennington, NJ
Publication Dates: c1988.
Literature type: Book
Language: English
Series: Proceedings / The Electrochemical Society ; v. 88-17
Subjects:
Integrated circuits > Congresses. > Congresses.
Electronic packaging > Congresses.
Polymers and polymerization > Congresses.
Carrier Form: vi, 213 p.:: ill. ; 23 cm.
Index Number: TN405
CLC: TN405.94-532
Call Number: TN405.94-53/S989/1987/
Contents: This symposium convened at the Fall meeting October 18-23, 1987, in Honolulu, Hawaii.

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