Screen Library低成本倒装芯片技术：DCA，WLCSP和PBGA芯片的贴装技术
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| Main Authors: | |
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| Group Author: | ; ; |
| Published: |
化学工业出版社
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| Publisher Address: | 北京 |
| Publication Dates: | 2006 |
| Literature type: | Book |
| Language: | Chinese |
| Subjects: | |
| Carrier Form: | 458页: 图 ; 24cm |
| ISBN: | 7-5025-8236-3 |
| Index Number: | TN43 |
| CLC: | TN43 |
| Call Number: | TN43/0433 |
| Contents: |
国外优秀科技著作出版专项基金资助 书名英文原名：Low cost flip chip technologies for DCA,WLCSP,and PBGA assemblies 共16章，内容涵盖了低成本倒装芯片从基本原理到最新进展的整个范围。 |