2018 International Conference on Simulation of Semiconductor Processes and Devices : (SISPAD 2018) : Austin, Texas, USA, 24-26 September 2018.

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Bibliographic Details
Corporate Authors: International Conference on Simulation of Semiconductor Processes and Devices Austin, Texas, USA; Institute of Electrical and Electronics Engineers
Published: IEEE,
Publisher Address: Piscataway, NJ :
Publication Dates: [2018]
Literature type: Book
Language: English
Subjects:
Item Description: IEEE Catalog Number: CFP18SSD-POD.
ISSN: 1946-1569.
Carrier Form: xxi, 373 pages : illustrations ; 28 cm
Bibliography: Includes bibliographical references and author index.
ISBN: 9781538667910
CLC: TN305-532
Call Number: TN305-532/I61/2018