Technical papers from IPC technical sessions /

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Bibliographic Details
Corporate Authors: Institute for Interconnecting and Packaging Electronic Circuits Northbrook, Ill.. Meeting
Published: The Institute,
Publisher Address: Evanston, Ill. :
Publication Dates: [1985]
Literature type: Book
Language: English
Subjects:
Item Description: Cover title.
Carrier Form: 1 volume (loose-leaf) : illustrations ; 29 cm
Index Number: TK7868
CLC: TN41-532
Call Number: TN41-532/M131/1983