Multichip modules:systems advantages, major constructions, and materials technologies

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Bibliographic Details
Group Author: Teng Robert K. F.; Balde John W., 1923-; Johnson R. Wayne, 1957-
Published: IEEE Press,
Publisher Address: New York
Publication Dates: c1991.
Literature type: Book
Language: English
Series: A volume in the IEEE Press selected reprint series
Subjects:
Carrier Form: ix, 603 p.: ill. ; 29 cm.
ISBN: 087942267X
Index Number: TN05
CLC: TN05-53
Call Number: TN05-53/M961/
Contents: Includes bibliographical references and indexes.