Electronic packaging materials science VII:symposium held Nov. 29 - Dec. 3, 1993, Boston, Mass., U.S.A.

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Bibliographic Details
Group Author: Borgesen Peter; Jensen Klavs F; Pollak Roger A
Published: Materials Research Society,
Publisher Address: Pittsburgh, PA.
Publication Dates: c1994.
Literature type: Book
Language: English
Series: Materials Research Society symposium proceedings ; v.323
Subjects:
Carrier Form: xiii, 450 p.: ill. ; 23 cm.
ISBN: 1558992227
Index Number: TN105
CLC: TN105-532
Call Number: TN105-532/E38/1993/