Screen LibraryTime-temperature parameters for creep-rupture analysis：papers from "Time-temperature parameters ; Methods and applications for creep rupture data I and II" of the Materials engineering congress held in Detroit, Michigan, 14-17 October 1968
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| Corporate Authors: | ; |
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| Group Author: | |
| Published: |
ASM,
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| Publisher Address: | Metals Park, Ohio |
| Publication Dates: | [19--] |
| Literature type: | Book |
| Language: | English |
| Series: |
ASM publication ; D8-100 |
| Subjects: | |
| Carrier Form: | 390 p.: ill., tab. |
| Index Number: | ? |
| CLC: | ? |
| Call Number: | U514.380.41/CA512/1968 |
| Contents: | Includes bibliographical references. |