Cover is for reference only

Stress-induced phenomena in metallization：Ninth International Workshop on Stress-Induced Phenomena in Metallization, Kyoto, Japan 4 - 6 April 2007

Saved in:
Bibliographic Details
Corporate Authors: International Workshop on Stress-Induced Phenomena in Metallization (9th 2007 Kyoto, Japan)
Group Author: Ho P. S.; Zschech Ehrenfried.; Ogawa Shinʾichi.
Published: American Institute of Physics,
Publisher Address: Melville, N.Y.
Publication Dates: ; 2007.
Literature type: Book
Language: English
Series: AIP conference proceedings ; 945
Subjects:
Metal-metal bonds.
Strength of materials.
Nanostructured materials.
Semiconductors
Copper > Electric properties
Interconnects (Integrated circuit technology) > Defects
Carrier Form: vii, 204 p.: ill. ; 24 cm.
ISBN: 9780735404595
0735404593
Index Number: TG172
CLC: TG172.9-532
Call Number: TG172.9-532/S915/2007
Contents: Includes bibliographical references and indexes.

Related Book Recommendations