Packaging of electronic systems:a mechanical engineering approach
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Main Authors: | |
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Published: |
McGraw-Hill,
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Publisher Address: | New York |
Publication Dates: | c1990. |
Literature type: | Book |
Language: | English |
Series: |
McGraw-Hill series in mechanical engineering |
Subjects: | |
Carrier Form: | xviii, 441 p.: ill. ; 25 cm. |
ISBN: | 0070152144 |
Index Number: | TN105 |
CLC: | TN105 |
Contents: | Includes bibliographical references (p. 430) and index. |