Screen Library3D microelectronic packaging : from fundamentals to applications /
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| Group Author: | ; |
|---|---|
| Published: |
Springer,
|
| Publisher Address: | Singapore : |
| Publication Dates: | [2021] |
| Literature type: | Book |
| Language: | English |
| Edition: | Second edition. |
| Series: |
Springer series in advanced microelectronics,
volume 64 |
| Subjects: | |
| Carrier Form: | xvii, 622 pages : illustrations (some color) ; 24 cm. |
| Bibliography: | Includes bibliographical references and index. |
| ISBN: |
9789811570926 9811570922 |
| CLC: | TN405 |
| Call Number: | TN405/T531-2/2nd ed. |