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Advances in electronic packaging, 1999：proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference : InterPACK '99 : presented at the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, June 13-19, 1999, Maui, Hawaii

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Bibliographic Details
Corporate Authors: Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference (1999 Maui, Hawaii); American Society of Mechanical Engineers. Electrical and Electronic Packaging Division.
Group Author: Saka M.; (Masumi); Lee Yung-Cheng.; Agonafer D.
Published: American Society of Mechanical Engineers,
Publisher Address: New York, N.Y.
Publication Dates: c1999.
Literature type: Book
Language: English
Series: EEP, ; vol. 26
Subjects:
Electronic packaging
Carrier Form: 2 v.: ill. ; 28 cm.
ISBN: 0791816125
Index Number: TN05
CLC: TN05-1
Call Number: TN05-1/P117/1999/v.1
Contents: Includes bibliographic references and author index.

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