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The 6th International Conference on ThermoMechanical Processing : TMP2022 /

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Bibliographic Details
Corporate Authors: International Conference on ThermoMechanical Processing Shenyang, China)
Group Author: Yuan, Guo (Editor); Xu, Wei (Editor)
Published: 冶金工业出版社,
Publisher Address: 北京 :
Publication Dates: 2022.
Literature type: Book
Language: English
Edition: 第1版.
Subjects:
Metals > Thermomechanical treatment > Congresses.
Item Description: "This books presents the proceedings of the 6th International Conference on ThermoMechanical Processing (TMP2022) held from September 6 to September 8, 2022 in Shenyang, China."
Carrier Form: x, 746 pages : illustrations ; 30 cm
Bibliography: Includes bibliographical references and index.
ISBN: 9787502492441
7502492445
Index Number: TN752
CLC: TG5-532
Call Number: TG5-532/I614/2022/chi

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