Screen LibraryElectronic materials and processes handbook
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| Group Author: | |
|---|---|
| Published: |
McGraw-Hill,
|
| Publisher Address: | New York |
| Publication Dates: | 2003. |
| Literature type: | Book |
| Language: | English |
| Edition: | 3rd ed. |
| Series: |
McGraw-Hill handbooks |
| Subjects: | |
| Carrier Form: | 1 v. (various pagings): ill. ; 25 cm. |
| ISBN: | 0071402144 (alk. paper) |
| Index Number: | TN04 |
| CLC: |
TN04-62 TN05-62 |
| Call Number: | TN04-62/E38.1/3rd.ed. |
| Contents: |
Includes bibliographical references and index. Development and fabrication of IC chips -- Plastics, elastomers, and composites -- Ceramics and glasses -- Metals -- Solder technologies for electronic packaging and assembly -- Electroplating and deposited metallic coatings -- Printed circuit board fabrication -- Materials and processes for hybrid microelectronics and multichip modules -- Adhesives, underfills, and coatings in electronics assemblies -- Thermal management materials and systems. |