Electronic materials and processes handbook
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Group Author: | |
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Published: |
McGraw-Hill,
|
Publisher Address: | New York |
Publication Dates: | 2003. |
Literature type: | Book |
Language: | English |
Edition: | 3rd ed. |
Series: |
McGraw-Hill handbooks |
Subjects: | |
Carrier Form: | 1 v. (various pagings): ill. ; 25 cm. |
ISBN: | 0071402144 (alk. paper) |
Index Number: | TN04 |
CLC: |
TN04-62 TN05-62 |
Call Number: | TN04-62/E38.1/3rd.ed. |
Contents: |
Includes bibliographical references and index. Development and fabrication of IC chips -- Plastics, elastomers, and composites -- Ceramics and glasses -- Metals -- Solder technologies for electronic packaging and assembly -- Electroplating and deposited metallic coatings -- Printed circuit board fabrication -- Materials and processes for hybrid microelectronics and multichip modules -- Adhesives, underfills, and coatings in electronics assemblies -- Thermal management materials and systems. |