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International Conference on Electronic Materials and Information Engineering (EMIE 2023) : 14-16 July 2023, Guangzhou, China /

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Bibliographic Details
Corporate Authors: International Conference on Electronic Materials and Information Engineering Guangzhou, China); Guangdong gong ye da xue (organizing body.); AEIC-Academic Exchange Information Centre (China) (sponsoring body.); SPIE (Society) (sponsoring body.)
Group Author: Tan, Wanyi (Editor); Zhang, Liang. (Editor)
Published: SPIE,
Publisher Address: Bellingham, Washington :
Publication Dates: [2023]
Literature type: Book
Language: English
Series: Proceedings of SPIE, volume 12919
Subjects:
Electronics > Materials > Congresses.
Électronique > Matériaux > Congrès.
Electronics > Materials.
Conference papers and proceedings.
Actes de congrès.
Item Description: "Organized by Guangdong University of Technology (China); sponsored by AEIC--Academic Exchange Information Centre (China)."
Carrier Form: 1 volume (various pagings) : illustrations ; 28 cm.
Bibliography: Includes bibliographical references.
ISBN: 9781510671331
1510671331
Index Number: TK7871
CLC: TN04-532
Call Number: TN04-532/I613-2/2023

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