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2015 IEEE 21st International Symposium on the Physical and Failure Analysis of Integrated Circuits : (IPFA 2015), Hsinchu, Taiwan, 29 June-2 July 2015.

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Bibliographic Details
Corporate Authors: IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits Hsinchu, Taiwan; Institute of Electrical and Electronic Engineers
Published: IEEE,
Publisher Address: Piscataway, NJ :
Publication Dates: [2015]
Literature type: Book
Language: English
Subjects:
Integrated circuits > Reliability > Congresses
Integrated circuits > Testing > Congresses
Semiconductors > Failures > Congresses
Integrated circuits > Defects > Congresses
Item Description: "IEEE Catalog Number: CFP15777-POD."
Carrier Form: xl, 580 pages : illustrations ; 28 cm
Bibliography: Includes bibliographical references.
ISBN: 9781479999293 :
CLC: TN4-532
Call Number: TN4-532/I61.6/2015

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