Software/hardware systems, systems engineering, advanced electronics packaging, and electromagnetic compatibility (EMC).
Saved in:
Corporate Authors: | ; |
---|---|
Published: |
Society of Automotive Engineers,
|
Publisher Address: | Warrendale, PA |
Publication Dates: | c2004. |
Literature type: | Book |
Language: | English |
Series: |
SP ; 1857 |
Subjects: | |
Carrier Form: | 222 p.: ill. ; 28 cm. |
ISBN: | 0768013933 |
Index Number: | U463 |
CLC: | U463.6-532 |
Call Number: | U463.6-532/S681-1/2004 |
Contents: |
"SAE 2004 World Congress, Cobo Center, Detroit, Michigan, March 8-11, 2004"--P. [4] of cover. "March 2004." "SAE/SP-1857"--T.p. verso. Includes bibliographical references. |