Cover is for reference only

Software/hardware systems, systems engineering, advanced electronics packaging, and electromagnetic compatibility (EMC).

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Bibliographic Details
Corporate Authors: SAE World Congress (2004 Detroit, Mich.); Society of Automotive Engineers
Published: Society of Automotive Engineers,
Publisher Address: Warrendale, PA
Publication Dates: c2004.
Literature type: Book
Language: English
Series: SP ; 1857
Subjects:
Automobiles > Electric equipment
Electronic packaging
Electromagnetic compatibility
Automobiles > Electronic equipment
Carrier Form: 222 p.: ill. ; 28 cm.
ISBN: 0768013933
Index Number: U463
CLC: U463.6-532
Call Number: U463.6-532/S681-1/2004
Contents: "SAE 2004 World Congress, Cobo Center, Detroit, Michigan, March 8-11, 2004"--P. [4] of cover.
"March 2004."
"SAE/SP-1857"--T.p. verso.
Includes bibliographical references.

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