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High-speed VLSI interconnections

This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections. In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition inclu...

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Bibliographic Details
Main Authors: Goel, Ashok K., 1953-
Published:
Literature type: eBook
Language: English
Edition: 2nd ed.
Series: Wiley series in microwave and optical engineering.
Subjects:
Very high speed integrated circuits > Mathematical models.
Very high speed integrated circuits > Defects > Mathematical models.
Integrated circuits > Very large scale integration > Computer simulation.
Semiconductors > Junctions.
TECHNOLOGY & ENGINEERING > VLSI & ULSI. > VLSI & ULSI. > VLSI & ULSI.
TECHNOLOGY & ENGINEERING > Logic. > Logic. > Logic.
COMPUTERS > Logic Design.
Electronic books.
Online Access: http://onlinelibrary.wiley.com/book/10.1002/9780470165973
Summary: This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections. In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk. Each chapter is designed to exist independently or as a par.
Carrier Form: 1 online resource (xix, 407 pages) : illustrations.
Bibliography: Includes bibliographical references and index.
ISBN: 9780470165973
0470165979
9780470165966
0470165960
Index Number: TK7874
CLC: TN47
Contents: High-Speed VLSI Interconnections; Contents; PREFACE; 1 Preliminary Concepts and More; 2 Parasitic Resistances, Capacitances, and Inductances; 3 Interconnection Delays; 4 Crosstalk Analysis; 5 Electromigration-Induced Failure Analysis; 6 Future Interconnections; INDEX.

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