Advanced MEMS packaging

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Bibliographic Details
Group Author: Lau John H
Published: McGraw-Hill,
Publisher Address: New York
Publication Dates: c2010.
Literature type: Book
Language: English
Subjects:
Carrier Form: xxiii, 552 p.: ill. ; 24 cm.
ISBN: 9780071626231 (hbk.)
0071626239 (alk. paper)
Index Number: TN405
CLC: TN405.94
TH-39
Call Number: TN405.94/A244
Contents: Includes bibliographical references and index.
Enabling technologies for advanced MEMS packaging -- Advanced MEMS wafer-level packaging -- Optical MEMS packaging : communications -- Optical MEMS packaging : bubble switch -- Optical MEMS : microbolometer packaging -- Bio-MEMS packaging -- Biosensor packaging -- Accelerometer packaging -- Radiofrequency MEMS switches -- RF MEMS tunable capacitors and tubable band-pass filters -- Advanced packaging of RF MEMS devices.