Advanced MEMS packaging
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Group Author: | |
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Published: |
McGraw-Hill,
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Publisher Address: | New York |
Publication Dates: | c2010. |
Literature type: | Book |
Language: | English |
Subjects: | |
Carrier Form: | xxiii, 552 p.: ill. ; 24 cm. |
ISBN: |
9780071626231 (hbk.) 0071626239 (alk. paper) |
Index Number: | TN405 |
CLC: |
TN405.94 TH-39 |
Call Number: | TN405.94/A244 |
Contents: |
Includes bibliographical references and index. Enabling technologies for advanced MEMS packaging -- Advanced MEMS wafer-level packaging -- Optical MEMS packaging : communications -- Optical MEMS packaging : bubble switch -- Optical MEMS : microbolometer packaging -- Bio-MEMS packaging -- Biosensor packaging -- Accelerometer packaging -- Radiofrequency MEMS switches -- RF MEMS tunable capacitors and tubable band-pass filters -- Advanced packaging of RF MEMS devices. |