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Proceedings of the 1997 1st Electronic Packaging Technology Conference

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Bibliographic Details
Corporate Authors: Electronic Packaging Technology Conference (1st 1997 Singapore; Components, Packaging & Manufacturing Technology Society; Institute of Materials Research and Engineering; Institute of Microelectronics; Institute of Electrical and Electronics Engineers
Group Author: Tay Andrew A. O; Lim Thiam Beng
Published: Institute of Electrical and Electronics Engineers,
Publisher Address: [Piscataway, N.J.]
Publication Dates: c1997.
Literature type: Book
Language: English
Subjects:
Electronic packaging > Congresses
Microelectronics > Congresses
Carrier Form: 319 p.: ill. ; 30 cm.
ISBN: 0780345170 (softbound)
0780341589 (microfiche)
Index Number: TN05
CLC: TN05-532
Call Number: TN05-532/E38.1/1997/
Contents: "IEEE catalog number: 97TH8307."
Conference held on 8-10 October 1997, Pan Pacific Hotel, Singapore.
Includes bibliographical references.

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