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Morphological evolution of electrodeposits and electrochemical processing in ULSI fabrication and electrodeposition of and on semiconductors IV：proceedings of the international symposia

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Bibliographic Details
Corporate Authors: Electrochemical Society. Electronics Division.; Electrochemical Society. Meeting 2001 Washington, D.C.) (Washington, D.C.)); Electrochemical Society. Electrodeposition Division.; Electrochemical Society. Dielectric Science and Technology Division.
Group Author: Kondo K.; (Kazuo)
Published: Electrochemical Society,
Publisher Address: Pennington, NJ
Publication Dates: c2005.
Literature type: Book
Language: English
Series: Proceedings ; v. 2001-08
Subjects:
Integrated circuits > Ultra large scale integration.
Interconnects (Integrated circuit technology)
Electroplating.
Copper plating.
Carrier Form: ix, 406 p.: ill. ; 24 cm.
ISBN: 1566773248
Index Number: TN470
CLC: TN470.5-532
Call Number: TN470.5-532/S989-2/2001
Contents: Papers from two symposia held during the 2001 spring meeting of the Electrochemical Society in Washington, D.C.
Includes bibliographical references and indexes.

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