Reset Filters
Branch: 上海图书馆

Cover is for reference only

Thermal conductivity 25：thermal expansion 13 : joint conferences, June 13-16, 1999, Ann Arbor, Michigan, USA

Saved in:
Bibliographic Details
Corporate Authors: International Thermal Conductivity Conference 1999 Ann Arbor, Mich.) (Ann Arbor, Mich.)); International Thermal Expansion Symposium 1999 Ann Arbor, Mich.) (Ann Arbor, Mich.))
Group Author: Morelli Donald; Uher Ctirad.
Published: Technomic Pub. Co.,
Publisher Address: Lancaster, Pa.
Publication Dates: [c2000]
Literature type: Book
Language: English
Subjects:
Materials > Thermal properties.
Expansion (Heat)
Heat > Conduction.
Carrier Form: xiv, 391 p.: ill. ; 24 cm.
ISBN: 1566768063
Index Number: O551
CLC: O551.3-532
Call Number: O551.3-532/T411/1999
Contents: Includes bibliographical references and indexes.

Related Book Recommendations