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Chemical mechanical planarization V：proceedings of the International Symposium

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Bibliographic Details
Corporate Authors: International Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing (5th 2002 Philadelphia, Pa.); Electrochemical Society. Meeting 2002 Philadelphia, Pa.) (Philadelphia, Pa.)); Electrochemical Society. Dielectric Science and Technology Division.; Electrochemical Society. Electronics Division.
Group Author: Seal S.; (Sudipta)
Published: Electrochemical Society, Inc.,
Publisher Address: Pennington, NJ
Publication Dates: c2002.
Literature type: Book
Language: English
Series: Proceedings ; v. 2002-1
Subjects:
Metals > Pickling.
Integrated circuits > Materials.
Microelectronics > Materials.
Grinding and polishing.
Carrier Form: vii, 274 p.: ill. ; 24 cm.
ISBN: 1566773296
Index Number: TN403
CLC: TN403-532
TN405-532
Call Number: TN403-532/I617/2002
Contents: "Proceedings of the Fifth International Symposium on Chemical Mechanical Planarization (CMP) in Integrated Circuit Device Manufacturing held at the 201st Meeting of the Electrochemical Society in Philadelphia, Pennsylvania from May 12th to 17th, 2002"--Pref.
"Sponsoring Divisions, Dielectric Science and Technology and Electronics."
Includes bibliographical references and indexes.

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