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Multilayer ceramic substrate-technology for VLSI package/multichip module

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Bibliographic Details
Main Authors: Otsuka Kanji
Published: Elsevier Applied Science,
Publisher Address: London
Publication Dates: c1993.
Literature type: Book
Language: English
Series: Ceramic research and development in Japan
Subjects:
Electronic ceramics
Electronic packaging > Materials
Intergrated circuits > Very large scale integration > Design and construction
Aluminum oxide
Carrier Form: xiii, 242 p.: ill. ; 25 cm.
ISBN: 185166579X
Index Number: TN47
CLC: TN47
TN603.5
Call Number: TN47/O88/
Contents: Translation of: Seramikku taso haisen kiban.
Includes bibliographical references (p. 223-231) and index.

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