Screen LibraryDesign for thermal stresses
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| Main Authors: | |
|---|---|
| Group Author: | |
| Published: |
Wiley,
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| Publisher Address: | Hoboken, N.J. |
| Publication Dates: | c2012. |
| Literature type: | Book |
| Language: | English |
| Subjects: | |
| Carrier Form: | xviii, 510 p.: ill. ; 25 cm. |
| ISBN: |
9780470627693 (hardback) 0470627697 (hardback) |
| Index Number: | O343 |
| CLC: | O343.6 |
| Call Number: | O343.6/B277 |
| Contents: |
Machine generated contents note: Preface.Nomenclature.Chapter 1. Introduction.1.1 Definition of Thermal Stress.1.2 Thermal-Mechanical Design.1.3 Factor of Safety in Design.1.4 Thermal Expansion Coefficient.1.5 Young's Modulus.1.6 Poisson's Ratio.1.7 Other Elastic Moduli.1.8 Thermal Diffusivity ... Includes bibliographical references and index. "This resource presents accessible coverage for designers of equipment that focuses on the basics through advanced design techniques for thermal stresses. Various numerical and analytical design approaches are introduced for thermal stresses, and example problems are included to illustrate the application of the principles for practicing engineers and students. Numerous problems and exercises further reinforce the coverage"--Provided by publisher. |