Electromigration Inside Logic Cells : Modeling, Analyzing and Mitigating Signal Electromigration in NanoCMOS /

This book describes new and effective methodologies for modeling, analyzing and mitigating cell-internal signal electromigration in nanoCMOS, with significant circuit lifetime improvements and no impact on performance, area and power. The authors are the first to analyze and propose a solution for t...

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Bibliographic Details
Main Authors: Posser, Gracieli (Author)
Corporate Authors: SpringerLink (Online service)
Group Author: Sapatnekar, Sachin S; Reis, Ricardo
Published: Springer International Publishing : Imprint: Springer,
Publisher Address: Cham :
Publication Dates: 2017.
Literature type: eBook
Language: English
Subjects:
Online Access: http://dx.doi.org/10.1007/978-3-319-48899-8
Summary: This book describes new and effective methodologies for modeling, analyzing and mitigating cell-internal signal electromigration in nanoCMOS, with significant circuit lifetime improvements and no impact on performance, area and power. The authors are the first to analyze and propose a solution for the electromigration effects inside logic cells of a circuit. They show in this book that an interconnect inside a cell can fail reducing considerably the circuit lifetime and they demonstrate a methodology to optimize the lifetime of circuits, by placing the output, Vdd and Vss pin of the cells in the less critical regions, where the electromigration effects are reduced. Readers will be enabled to apply this methodology only for the critical cells in the circuit, avoiding impact in the circuit delay, area and performance, thus increasing the lifetime of the circuit without loss in other characteristics. .
Carrier Form: 1 online resource (XX, 118 pages) : illustrations
ISBN: 9783319488998
Index Number: TK7888
CLC: TP331
Contents: Chapter 1. Introduction -- Chapter 2. State of the Art -- Chapter 3. Modeling Cell-internal EM -- Chapter 4. Current Calculation -- Chapter 5. Experimental Setup -- Chapter 6.Results -- Chapter 7. Analyzing the Electromigration Effects on Different Metal Layers -- Chapter 8. Conclusions.