Microjoining and nanojoining /
Many important advances in technology have been associated with nanotechnology and the miniaturization of components, devices and systems. Microjoining has been closely associated with the evolution of microelectronic packaging, but actually covers a much broader area, and is essential for manufactu...
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Corporate Authors: | ; |
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Group Author: | |
Published: |
Woodhead Pub. and Maney Pub., on behalf of the Institute of Materials, Minerals & Mining ; CRC Press,
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Publisher Address: | Cambridge, England : Boca Raton : |
Publication Dates: | 2008. |
Literature type: | eBook |
Language: | English |
Series: |
Woodhead Publishing in materials
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Subjects: | |
Online Access: |
http://www.sciencedirect.com/science/book/9781845691790 |
Summary: |
Many important advances in technology have been associated with nanotechnology and the miniaturization of components, devices and systems. Microjoining has been closely associated with the evolution of microelectronic packaging, but actually covers a much broader area, and is essential for manufacturing many electronic, precision and medical products. Part one reviews the basics of microjoining, including solid-state bonding and fusion microwelding. Part two covers microjoining and nanojoining processes, such as bonding mechanisms and metallurgy, process development and optimization, thermal |
Carrier Form: | 1 online resource (xxiv, 810 pages) : illustrations. |
Bibliography: | Includes bibliographical references and index. |
ISBN: |
9781615831845 1615831843 1845691792 9781845691790 9781845694043 184569404X |
Index Number: | TK7875 |
CLC: | TN4 |
Contents: | Introduction -- Basics of microjoining: Mechanisms of solid-state bonding processes / J.E. Gould. Mechanisms of soldering and brazing / T. Takemoto. Fundamentals of fusion microwelding / G.A. Knorovsky. Modeling of solid state bonding / Y. Takahashi. Modeling of fusion microwelding / B.H. Chang. Sensing, monitoring and control / M. Mayer. Assembly process automation and materials handling / Y.M. Cheung, D. Liu -- Microjoining and nanojoining processes: Microelectronics wire bonding / I. Lum, M. Mayer, Y. Zhou. Solid-state diffusion bonding / A. Shirzadi. Bonding using nanoparticles / A. Hiro |