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Microjoining and nanojoining /

Many important advances in technology have been associated with nanotechnology and the miniaturization of components, devices and systems. Microjoining has been closely associated with the evolution of microelectronic packaging, but actually covers a much broader area, and is essential for manufactu...

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Bibliographic Details
Corporate Authors: Elsevier Science & Technology; Institute of Materials, Minerals, and Mining
Group Author: Zhou, Y
Published: Woodhead Pub. and Maney Pub., on behalf of the Institute of Materials, Minerals & Mining ; CRC Press,
Publisher Address: Cambridge, England : Boca Raton :
Publication Dates: 2008.
Literature type: eBook
Language: English
Series: Woodhead Publishing in materials
Subjects:
Microelectromechanical systems > Design and construction
Nanoelectromechanical systems > Design and construction
Microtechnology
Nanotechnology
Joints Engineering
Sealing Technology
Metal bonding
Microelectronics
Nanoelectronics
TECHNOLOGY & ENGINEERING > Technical & Manufacturing Industries & Trades
Festko rper
Mikroelektronik
Nanoelektronik
Nanostrukturiertes Material
Verbindungstechnik
Electronic books
Handbooks and manuals
Aufsatzsammlung
Online Access: http://www.sciencedirect.com/science/book/9781845691790
Summary: Many important advances in technology have been associated with nanotechnology and the miniaturization of components, devices and systems. Microjoining has been closely associated with the evolution of microelectronic packaging, but actually covers a much broader area, and is essential for manufacturing many electronic, precision and medical products. Part one reviews the basics of microjoining, including solid-state bonding and fusion microwelding. Part two covers microjoining and nanojoining processes, such as bonding mechanisms and metallurgy, process development and optimization, thermal
Carrier Form: 1 online resource (xxiv, 810 pages) : illustrations.
Bibliography: Includes bibliographical references and index.
ISBN: 9781615831845
1615831843
1845691792
9781845691790
9781845694043
184569404X
Index Number: TK7875
CLC: TN4
Contents: Introduction -- Basics of microjoining: Mechanisms of solid-state bonding processes / J.E. Gould. Mechanisms of soldering and brazing / T. Takemoto. Fundamentals of fusion microwelding / G.A. Knorovsky. Modeling of solid state bonding / Y. Takahashi. Modeling of fusion microwelding / B.H. Chang. Sensing, monitoring and control / M. Mayer. Assembly process automation and materials handling / Y.M. Cheung, D. Liu -- Microjoining and nanojoining processes: Microelectronics wire bonding / I. Lum, M. Mayer, Y. Zhou. Solid-state diffusion bonding / A. Shirzadi. Bonding using nanoparticles / A. Hiro

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