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2014 IEEE 21st International Symposium on the Physical and Failure Analysis of Integrated Circuits : (IPFA 2014), Singapore, 30 June-4 July 2014 /

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Bibliographic Details
Corporate Authors: International Symposium on the Physical and Failure Analysis of Integrated Circuits Singapore; Institute of Electrical and Electronic Engineers
Published: IEEE,
Publisher Address: [Piscataway, N.J.] :
Publication Dates: [2014]
Literature type: Book
Language: English
Subjects:
Integrated circuits > Reliability > Congresses
Integrated circuits > Testing > Congresses
Semiconductors > Failures > Congresses
Integrated circuits > Defects > Congresses
Item Description: IEEE Catalog Number: CFP14777-POD.
Carrier Form: xliv, 389 pages : illustrations ; 27 cm
Bibliography: Includes bibliographical references.
ISBN: 9781479939114 :
CLC: TN4-532
Call Number: TN4-532/I61.6/2014

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