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Advances in microwaves /

Advances in Microwaves, Volume 8 covers the developments in the study of microwaves. The book discusses the circuit forms for microwave integrated circuits; the analysis of microstrip transmission lines; and the use of lumped elements in microwave integrated circuits. The text also describes the mic...

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Bibliographic Details
Corporate Authors: Elsevier Science & Technology.
Group Author: Young, Leo. (Editor); Sobol, H. (Editor)
Published: Academic Press,
Publisher Address: New York :
Publication Dates: 1974.
Literature type: eBook
Language: English
Subjects:
Microwaves.
Electronic books.
Online Access: http://www.sciencedirect.com/science/bookseries/00652946/8
Summary: Advances in Microwaves, Volume 8 covers the developments in the study of microwaves. The book discusses the circuit forms for microwave integrated circuits; the analysis of microstrip transmission lines; and the use of lumped elements in microwave integrated circuits. The text also describes the microwave properties of ferrimagnetic materials, as well as their interaction with electromagnetic waves propagating in bounded waveguiding structures. The integration techniques useful at high frequencies; material technology for microwave integrated circuits; specific requirements on technology for d.
Carrier Form: 1 online resource (xiii, 407 pages) : illustrations
Bibliography: Includes bibliographical references and index.
ISBN: 9781483215570
1483215571
Index Number: TK7870 A32 V
CLC: TN015
Contents: Front Cover; Advances in Microwaves; Copyright Page; Table of Contents; Contributors; Contents of Previous Volumes; Chapter 1. Microwave Integrated Circuits; I. Introduction; II. Circuit Forms for Microwave Integrated Circuits; References; Chapter 2. The Technology of Microwave Integrated Circuits; I. Introduction; II. Monolithic Technology; III. Hybrid Technology; IV. Comparison between Monolithic and Hybrid Circuits; V. Properties of High Resistivity Semiconducting Substrates; VI. Substrates for Hybrid Circuits; VII. Deposited Metals for MICs (Thin-Film Technology).
VIII. Fired Film Metallization (Thick-Film Technology)IX. Fired vs. Deposited Films in MICs; X. Other Film Materials; XI. Circuit Requirements and Fabrication; XII. Characterization and Incorporation of Active Devices in MICs; References; Chapter 3. Analysis of Microstrip Transmission Lines; I. Introduction; II. Quasi-Tem Analysis for Microstrip Line Structure; III. Wave Theory Analysis of Microstrip Lines; IV. Higher Order Modes; V. Losses in Microstrip Lines; VI. Radiation and End Loading; VII. Conclusions; References; Chapter 4. Lumped Elements in Microwave Integrated Circuits.
I. IntroductionII. Lumped-Element Design; III. Design of Inductors and Resistors; IV. Design of Capacitors; V. The Measurement and Performance of Lumped Elements to 12 GHz; VI. Lumped-Element Circuits; VII. Status of Lumped-Element Applications; References; Chapter 5. Integrated Ferrimagnetic Devices; I. Introduction; II. Electromagnetic Wave Propagation in Bounded Media; III. Integrated Ferrite Phase Shifters; IV. Circulators; V. Edge Guided Devices; References; Chapter 6. Microwave Propagation on Coupled Pairs of Microstrip Transmission Lines; I. Introduction.
II. The Coupled Microstrip ConfigurationIII. Normal Modes of Propagation in the Quasi-TEM Regime; IV. Presentations of Data; References; Chapter 7. Computer Aided Design, Simulation and Optimization; I. Introduction; II. Analysis of Microwave Circuits; III. Analytical Characterization of Cascaded Distributed Elements; IV. Performance Simulation Techniques; V. Fundamentals of Optimization; VI. Description and Application of DEMON (Diminishing Error Method of Optimization for Networks); VII. Conclusions; Appendix: Program Listing for DEMON (Fortran IV); References; Subject Index.

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