Screen LibraryMaterials and failures in MEMS and NEMS /
Saved in:
| Corporate Authors: | |
|---|---|
| Group Author: | ; |
| Published: |
John Wiley & Sons ; Scrivener Publishing,
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| Publisher Address: | Hoboken, New Jersey : Salem, Massachusetts : |
| Publication Dates: | 2015. |
| Literature type: | eBook |
| Language: | English |
| Series: |
Materials degradation and failures series
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| Subjects: | |
| Online Access: |
http://onlinelibrary.wiley.com/book/10.1002/9781119083887 |
| Carrier Form: | 1 online resource. |
| Bibliography: | Includes bibliographical references and index. |
| ISBN: |
9781119083870 (pdf) 1119083877 (pdf) 9781119083863 (electronic bk.) 1119083869 (electronic bk.) 9781119083887 1119083885 1119083605 9781119083603 |
| Access: | Owing to Legal Deposit regulations this resource may only be accessed from within National Library of Scotland. For more information contact enquiries@nls.uk. |
| Index Number: | TK7875 |
| CLC: | TN602 |
| Contents: |
""Half Title page""; ""Title page""; ""Copyright page""; ""Preface""; ""Chapter 1: Carbon as a MEMS Material""; ""1.1 Introduction""; ""1.2 Structure and Properties of Glassy Carbon""; ""1.3 Fabrication of C-MEMS Structures""; ""1.4 Integration of C-MEMS Structures with Other Materials""; ""1.5 Conclusion""; ""References""; ""Chapter 2: Intelligent Model-Based Fault Diagnosis of MEMS""; ""2.1 Introduction""; ""2.2 Model-Based Fault Diagnosis""; ""2.3 Self-Tuning Estimation""; ""References""; ""Chapter 3: MEMS Heat Exchangers""; ""3.1 Introduction"" ""3.2 Fundamentals of Thermodynamics, Fluid Mechanics, and Heat Transfer""""3.3 MEMS Heat Sinks""; ""3.4 MEMS Heat Pipes""; ""3.5 Two-Fluid MEMS Heat Exchanger""; ""3.6 Need for Microscale Internal Flow Passages""; ""Nomenclature""; ""Greek Alphabets""; ""Subscripts""; ""References""; ""Chapter 4: Application of Porous Silicon in MEMS and Sensors Technology""; ""4.1 Introduction""; ""4.2 Porous Silicon in Biosensors""; ""4.3 Porous Silicon for Pressure Sensors""; ""4.4 Conclusion""; ""References""; ""Chapter 5: MEMS/NEMS Switches with Silicon to Silicon (Si-to-Si) Contact Interface"" ""5.1 Introduction""""5.2 Bi-Stable CMOS Front End Silicon Nanofin (SiNF) Switch for Non-volatile Memory Based On Van Der Waals Force""; ""5.3 Vertically Actuated U-Shape Nanowire NEMS Switch""; ""5.4 A Vacuum Encapsulated Si-to-Si MEMS Switch for Rugged Electronics""; ""5.5 Summary""; ""References""; ""Chapter 6: On the Design, Fabrication, and Characterization of cMUT Devices""; ""6.1 Introduction""; ""6.2 cMUT Design and Finite Element Modeling Simulation""; ""6.3 cMUT Fabrication and Characterization""; ""6.4 Summary and Conclusions""; ""Acknowledgments""; ""References"" ""Chapter 7: Inverse Problems in the MEMS/NEMS Applications""""7.1 Introduction""; ""7.2 Inverse Problems in the Micro/Nanomechanical Resonators""; ""7.3 Inverse Problems in the MEMS Stiction Test""; ""Acknowledgment""; ""References""; ""Chapter 8: Ohmic RF-MEMS Control""; ""8.1 Introduction""; ""8.2 Charge Drive Control (Resistive Damping)""; ""8.3 Hybrid Drive Control""; ""8.4 Control Under High-Pressure Gas Damping""; ""8.5 Comparison between Different Control Modes""; ""References""; ""Chapter 9: Dynamics of MEMS Devices""; ""9.1 Introduction""; ""9.2 Modeling and Simulation"" ""9.3 Fabrication Methods""""9.4 Characterization""; ""9.5 Device Failures""; ""Acknowledgments""; ""References""; ""Chapter 10: Buckling Behaviors and Interfacial Toughness of a Micron-Scale Composite Structure with a Metal Wire on a Flexible Substrate""; ""10.1 Introduction""; ""10.2 Buckling Behaviors of Constantan Wire under Electrical Loading""; ""10.3 Interfacial Toughness between Constantan Wire and Polymer Substrate""; ""10.4 Buckling Behaviors of Polymer Substrate Restricted by Constantan Wire""; ""10.5 Conclusions""; ""Acknowledgments""; ""References"" |