Joining technologies for the 1990s:welding, brazing, soldering, mechanical, expolsive, solid-state, adhesive

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Bibliographic Details
Group Author: Buckley John D; Stein Bland A
Published: Noyes Data Corp.,
Publisher Address: Park Ridge, N.J., U.S.A.
Publication Dates: 1986.
Literature type: Book
Language: English
Subjects:
Carrier Form: xviii, 480 p.: ill. ; 25 cm.
ISBN: 0815510950
Index Number: TG4
CLC: TG4-532
Call Number: TG4-53/J74.1/1984/
Contents: Proceedings of a symposium held at NASA's Langley Research Center, Hampton, Va., Oct. 1984.
Includes bibliographies and index.