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2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits : (IPFA 2022) : Singapore, 18-21 July 2022.

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Bibliographic Details
Corporate Authors: International Symposium on the Physical & Failure Analysis of Integrated Circuits Singapore); Institute of Electrical and Electronics Engineers.
Published: IEEE,
Publisher Address: Piscataway, NJ :
Publication Dates: [2022]
Literature type: Book
Language: English
Subjects:
Integrated circuits > Reliability > Congresses.
Integrated circuits > Testing > Congresses.
Semiconductors > Failures > Congresses.
Integrated circuits > Defects > Congresses.
Item Description: IEEE Catalog Number: CFP22777-POD.
ISSN: 1946-1542.
Carrier Form: 418 pages : illustrations ; 28 cm
Bibliography: Includes bibliographical references and author index.
ISBN: 9781665498166
CLC: TN4-532
Call Number: TN4-532/I61.6/2022

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