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Author: sponsored by ECA, Electronic Components, Assemblies and Materials Association. Organized by CTI, Components Technology Institute, Inc

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IEEE Transactions on Electronics Packaging Manufacturing

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Bibliographic Details
Corporate Authors: Institute of Electrical and Electronics Engineers IEEE Components, Packaging and Manufacturing Technology Society
Published: IEEE Inc.
Publisher Address: New York
Publication Dates: 1999-2010
Literature type: Journal
Language: English
Online Access: http://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=6104
Carrier Form: 11v.: ill. ; 29cm
Publication Frequency: Quarterly
ISSN: 1521-334X
1558-0822 online
Order Number: 730B0001TCP3
Index Number: TB48
CLC: TB48
Call Number: P11668-3A/12483-3A
Journal Holding: Vol.22-33 1999-2010
Contents: Continues: IEEE Transacrtions on Components, Packaging & Manufacturing Technology. Pt.C, Manufacturing (ISSN 1083-4400)
Merged with: IEEE Transactions of Advanced Packaging (ISSN 1521-3323); and: IEEE Transactions on Components and Packaging Technology (ISSN 1521-3331) to form: IEEE Transactions on Components, Packaging, and Manufacturing Technology (ISSN 2156-3950)

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