Screen LibrarySemiconductor advanced packaging /
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on...
Saved in:
| Main Authors: | |
|---|---|
| Published: |
Springer,
|
| Publisher Address: | Singapore : |
| Publication Dates: | [2021] |
| Literature type: | Book |
| Language: | English |
| Subjects: | |
| Summary: |
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc. |
| Carrier Form: | xxii, 498 pages : illustrations (chiefly color), forms ; 24 cm |
| Bibliography: | Includes bibliographical references and index. |
| ISBN: |
9789811613753 9811613753 |
| Index Number: | TK7871 |
| CLC: | TN303 |
| Call Number: | TN303/S471-2 |
| Contents: | Recent Advance on Semiconductor Packaging -- System-in-Package -- Fan-In Wafer/Panel-Level Chip-Scale Packages -- Fan-Out Wafer/Panel-Level Packaging -- 2D, 2.1D, and 2.3D IC Integration -- 2.5D IC Integration -- 3D IC Integration -- Hybrid Bonding -- Chiplets Packaging -- Dielectric Materials -- Trends and Roadmap for Advanced Semiconductor Packaging. |