Screen LibraryAdhesives technology for electronic applications : materials, processes, reliability /
This book is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new develo...
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| Main Authors: | |
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| Corporate Authors: | |
| Group Author: | |
| Published: |
William Andrew Pub.,
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| Publisher Address: | Norwich, NY : |
| Publication Dates: | 2005. |
| Literature type: | eBook |
| Language: | English |
| Series: |
Materials and processes for electronic applications series
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| Subjects: | |
| Online Access: |
http://www.sciencedirect.com/science/book/9780815515135 |
| Summary: |
This book is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new developments in anisotropic, electrically conductive, and underfill adhesives. Rapid curing methods such as UV, microwave, and moisture (which comply with current environmental and energy requirements) are covered. Over 80 tables and 120 figures provide a wealth of data on properties, performance, and reliability. Also included are examples of commercially available adhesives, suppliers, and equipment. Each chapter provides comprehensive references. |
| Carrier Form: | 1 online resource (xvi, 459 pages) : illustrations. |
| Bibliography: | Includes bibliographical references and index. |
| ISBN: |
0815515138 9780815515135 1591249422 9781591249429 9780080947167 0080947166 9780815516002 0815516002 |
| Index Number: | TK7871 |
| CLC: | TN04 |
| Contents: | Introduction -- Functions and Theory of Adhesives -- Chemistry, Formulation, and Properties of Adhesives -- Adhesive Bonding Properties -- Applications -- Reliability -- Test and Inspection Methods -- Appendix -- Conversion Factors -- Abbreviations and Acronyms -- Index. |