Screen LibraryLead-free soldering process development and reliability /
"This book discusses ongoing issues in electronics manufacturing production. Each topic is discussed by those who have conducted work in the field and can provide insight into what are the most important areas to consider. The book gives updates in areas for which research is ongoing, and addre...
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| Group Author: | |
|---|---|
| Published: |
John Wiley & Sons, Inc.,
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| Publisher Address: | Hoboken, NJ, USA : |
| Publication Dates: | 2020. |
| Literature type: | Book |
| Language: | English |
| Series: |
Wiley series in quality and reliability engineering. |
| Subjects: | |
| Summary: |
"This book discusses ongoing issues in electronics manufacturing production. Each topic is discussed by those who have conducted work in the field and can provide insight into what are the most important areas to consider. The book gives updates in areas for which research is ongoing, and addresses new topics which are relevant to lead-free soldering. Among the key topics the book highlights are emerging environmental legislation, developments in process engineering, alloys, PCB surface finishes, PCB laminates, reliability assessments and standards. A practicing engineer will find the book of use as it goes into these and other topics in sufficient detail to make it informative and a good practical guide to address issues of concern in these areas. Investigates high temperature, low temperature, and high reliability lead-free alloys. Describes the effects of intermetallic compound on reliability. Explains updates in lead-free rework technology including hand soldering, BGA rework, and PTH rework. Provides a guideline to going lead-free to industries that are complying with new environmental regulations, such as defense, aerospace, medical, and automotive industries"-- |
| Carrier Form: | xxii, 481 pages : illustrations ; 24 cm. |
| Bibliography: | Includes bibliographical references and index. |
| ISBN: |
9781119482031 1119482038 |
| Index Number: | TK7870 |
| CLC: | TN405.94 |
| Call Number: | TN405.94/L434-1 |
| Contents: | Chapter 1: Lead-Free Surface Mount Technology Chapter 2: Wave/Selective Soldering Chapter 3: Lead-free Rework Chapter 4: Solder Paste and Flux Technology Chapter 5: Low Temperature Lead-free Alloys and Solder Pastes Chapter 6: High Temperature Lead-Free Bonding Materials-the need, the potential candidates and the challenges Chapter 7: Lead (Pb)-Free Solders for High Reliability and High-Performance Applications Chapter 8 -- Lead-free Printed Wiring Board Surface Finishes CHAPTER 9 -- PCB Laminates (Including High Speed Requirements) Chapter 10: Underfills and Encapsulants Used in Lead-Free Electronic Assembly Chapter 11: Thermal Cycling and General Reliability Considerations Chapter 12: Intermetallic Compounds Chapter 13: Conformal Coatings |